Technical Documents
Specifications
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Row Pitch
6.18mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Country of Origin
Costa Rica
Product Details
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
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Stock information temporarily unavailable.
€ 571.20
€ 13.60 Each (In a Tray of 42) (Exc. Vat)
€ 691.15
€ 16.456 Each (In a Tray of 42) (inc. VAT)
42
€ 571.20
€ 13.60 Each (In a Tray of 42) (Exc. Vat)
€ 691.15
€ 16.456 Each (In a Tray of 42) (inc. VAT)
Stock information temporarily unavailable.
42
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
Technical Documents
Specifications
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Row Pitch
6.18mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Country of Origin
Costa Rica
Product Details
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
