Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Surface Mount
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55917
Srovės įvertinimas
3.0A
Įtampos reitingas
250.0 V
Produkto aprašymas
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 6,06
€ 0,606 Each (In a Pack of 10) (be PVM)
€ 7,33
€ 0,733 Each (In a Pack of 10) (su PVM)
Standartas
10
![sticker-462](https://cms.rsdelivers.com/repository-v1/nuolaida-7.gif)
€ 6,06
€ 0,606 Each (In a Pack of 10) (be PVM)
€ 7,33
€ 0,733 Each (In a Pack of 10) (su PVM)
Standartas
10
![sticker-462](https://cms.rsdelivers.com/repository-v1/nuolaida-7.gif)
Pirkti dideliais kiekiais
kiekis | Vieneto kaina | Per Pakuotė |
---|---|---|
10 - 190 | € 0,606 | € 6,06 |
200 - 740 | € 0,522 | € 5,22 |
750 - 2990 | € 0,448 | € 4,48 |
3000 - 5990 | € 0,321 | € 3,21 |
6000+ | € 0,296 | € 2,96 |
Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Surface Mount
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55917
Srovės įvertinimas
3.0A
Įtampos reitingas
250.0 V
Produkto aprašymas
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.