Techniniai dokumentai
Specifikacijos
Markė
Amphenol ICCKontaktų skaičius
44
Gender
Female
Body Orientation
Straight
Tvirtinimo tipas
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Užbaigimo būdas
Solder
D-Sub Shell Size
B
Srovės įvertinimas
2.5A
Housing Material
Steel
Įtampos reitingas
250.0 V
Ilgis
53.04mm
Plotis
4.8mm
Gylis
12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Matmenys
53.04 x 4.8 x 12.55mm
Minimali darbinė temperatūra
-55.0°C
Maksimali darbinė temperatūra
+105°C
Kilmės šalis
China
Produkto aprašymas
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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€ 4,75
už 1 vnt. (be PVM)
€ 5,75
už 1 vnt. (su PVM)
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€ 4,75
už 1 vnt. (be PVM)
€ 5,75
už 1 vnt. (su PVM)
1
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Techniniai dokumentai
Specifikacijos
Markė
Amphenol ICCKontaktų skaičius
44
Gender
Female
Body Orientation
Straight
Tvirtinimo tipas
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Užbaigimo būdas
Solder
D-Sub Shell Size
B
Srovės įvertinimas
2.5A
Housing Material
Steel
Įtampos reitingas
250.0 V
Ilgis
53.04mm
Plotis
4.8mm
Gylis
12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Matmenys
53.04 x 4.8 x 12.55mm
Minimali darbinė temperatūra
-55.0°C
Maksimali darbinė temperatūra
+105°C
Kilmės šalis
China
Produkto aprašymas
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.