Technical Document
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
15μF
Mount Type
Surface Mount
Package/Case
2012-12
Polarity
Polar
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
2 x 1.25 x 1.2 mm
Height
1.2mm
Depth
1.25mm
Length
2mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Ripple Current
0.56A
Leakage Current
10μA
Automotive Standard
No
Dissipation Factor
10%
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
€ 570.00
€ 0.19 Each (On a Reel of 3000) (Exc. Vat)
€ 689.70
€ 0.23 Each (On a Reel of 3000) (inc. VAT)
3000

€ 570.00
€ 0.19 Each (On a Reel of 3000) (Exc. Vat)
€ 689.70
€ 0.23 Each (On a Reel of 3000) (inc. VAT)
Stock information temporarily unavailable.
3000

Technical Document
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
15μF
Mount Type
Surface Mount
Package/Case
2012-12
Polarity
Polar
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
2 x 1.25 x 1.2 mm
Height
1.2mm
Depth
1.25mm
Length
2mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Ripple Current
0.56A
Leakage Current
10μA
Automotive Standard
No
Dissipation Factor
10%
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
