Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
33 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
€ 494.00
€ 0.247 Each (On a Reel of 2000) (Exc. Vat)
€ 597.74
€ 0.299 Each (On a Reel of 2000) (inc. VAT)
2000

€ 494.00
€ 0.247 Each (On a Reel of 2000) (Exc. Vat)
€ 597.74
€ 0.299 Each (On a Reel of 2000) (inc. VAT)
Stock information temporarily unavailable.
2000

Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
33 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
