Techniniai dokumentai
Specifikacijos
Markė
TE ConnectivityPlug/Socket
Socket
Gender
Female
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Kilmės šalis
United States
Produkto aprašymas
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 7,245
Each (In a Tube of 46) (be PVM)
€ 8,766
Each (In a Tube of 46) (su PVM)
46
€ 7,245
Each (In a Tube of 46) (be PVM)
€ 8,766
Each (In a Tube of 46) (su PVM)
46
Techniniai dokumentai
Specifikacijos
Markė
TE ConnectivityPlug/Socket
Socket
Gender
Female
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Kilmės šalis
United States
Produkto aprašymas
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.