Techniniai dokumentai
Specifikacijos
Markė
MolexKontaktų skaičius
2
Number Of Rows
1
Pitch
2.54mm
Gender
Female
Tvirtinimo tipas
Panel Mount
Serija
C-GRID III
For Use With
C-Grid III Connector
Body Orientation
Straight
Ilgis
6.14mm
Plotis
5.35mm
Housing Material
PPO
Užbaigimo būdas
Crimp
Produkto aprašymas
Molex C-Grid III Interconnection System Connector Housings
This range of Connector Housings feature a 2.54 mm pitch and form part of the C-Grid III interconnection system from Molex. This system offers post and receptacle interconnection, with design flexibility and modular components that provide a wide range of interconnection packaging alternatives within the electronic markets. Ideal for use with a wide range of commercial and consumer applications.
2.54mm Molex C-Grid III Range
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 0,591
Už kiekviena vnt. (tiekiama dežeje) (be PVM)
€ 0,715
Už kiekviena vnt. (tiekiama dežeje) (su PVM)
Gamybinė pakuotė (Maišas)
5
![sticker-462](https://cms.rsdelivers.com/repository-v1/nuolaida-7.gif)
€ 0,591
Už kiekviena vnt. (tiekiama dežeje) (be PVM)
€ 0,715
Už kiekviena vnt. (tiekiama dežeje) (su PVM)
Gamybinė pakuotė (Maišas)
5
![sticker-462](https://cms.rsdelivers.com/repository-v1/nuolaida-7.gif)
Pirkti dideliais kiekiais
kiekis | Vieneto kaina | Per Maišas |
---|---|---|
5 - 120 | € 0,591 | € 2,95 |
125 - 495 | € 0,379 | € 1,90 |
500 - 2495 | € 0,352 | € 1,76 |
2500 - 4995 | € 0,284 | € 1,42 |
5000+ | € 0,272 | € 1,36 |
Techniniai dokumentai
Specifikacijos
Markė
MolexKontaktų skaičius
2
Number Of Rows
1
Pitch
2.54mm
Gender
Female
Tvirtinimo tipas
Panel Mount
Serija
C-GRID III
For Use With
C-Grid III Connector
Body Orientation
Straight
Ilgis
6.14mm
Plotis
5.35mm
Housing Material
PPO
Užbaigimo būdas
Crimp
Produkto aprašymas
Molex C-Grid III Interconnection System Connector Housings
This range of Connector Housings feature a 2.54 mm pitch and form part of the C-Grid III interconnection system from Molex. This system offers post and receptacle interconnection, with design flexibility and modular components that provide a wide range of interconnection packaging alternatives within the electronic markets. Ideal for use with a wide range of commercial and consumer applications.