Technical Document
Specifications
Brand
MolexSeries
C-Grid
Product Type
PCB Header
Pitch
2.54mm
Current
2.5A
Number of Contacts
20
Housing Material
Polybutylene Terephthalate
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.43mm
Maximum Operating Temperature
120°C
Mating Pin Length
2.54mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-33-585
Product details
Vertical DIL Shrouded Headers, 70246 Series
Mates 70058 Series terminals typical stock number 670-6293
Gold plating depth 0.38 μm unless otherwise stated
2.54mm Molex C-Grid/SL Series
Stock information temporarily unavailable.
€ 190.00
€ 1.90 Each (Supplied in a Bag) (Exc. Vat)
€ 229.90
€ 2.299 Each (Supplied in a Bag) (inc. VAT)
Production pack (Bag)
100

€ 190.00
€ 1.90 Each (Supplied in a Bag) (Exc. Vat)
€ 229.90
€ 2.299 Each (Supplied in a Bag) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Bag)
100

| Quantity | Unit price | Per Bag |
|---|---|---|
| 100 - 370 | € 1.90 | € 9.50 |
| 375 - 1495 | € 1.80 | € 9.00 |
| 1500 - 2995 | € 1.55 | € 7.75 |
| 3000+ | € 1.50 | € 7.50 |
Technical Document
Specifications
Brand
MolexSeries
C-Grid
Product Type
PCB Header
Pitch
2.54mm
Current
2.5A
Number of Contacts
20
Housing Material
Polybutylene Terephthalate
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.43mm
Maximum Operating Temperature
120°C
Mating Pin Length
2.54mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-33-585
Product details
Vertical DIL Shrouded Headers, 70246 Series
Mates 70058 Series terminals typical stock number 670-6293
Gold plating depth 0.38 μm unless otherwise stated


