Techniniai dokumentai
Specifikacijos
Markė
InfineonTvirtinimo tipas
Through Hole
Pakuotės tipas
TO-220
Maximum Continuous Forward Current
15A
Peak Reverse Repetitive Voltage
1200V
Diode Configuration
Single
Rectifier Type
High Voltage
Diode Type
SiC Schottky
Kaiščių skaičius
2
Maximum Forward Voltage Drop
2.55V
Number of Elements per Chip
1
Diode Technology
SiC Schottky
Peak Non-Repetitive Forward Surge Current
78A
Kilmės šalis
Singapore
Produkto aprašymas
thinQ! Silicon Carbide (SiC) Schottky Diode, Infineon
The Infineon thinQ!™ Generation 5 offers a new thin wafer technology for SiC Schottky Barrier diodes improving the thermal characteristics. The SiC Schottky Diode devices offer advantageous high voltage power semiconductor features such as higher breakdown field strength and improved thermal conductivity allowing greater efficiency levels. This latest generation is suitable for use in Telecom SMPS and high-end Servers, UPS systems, Motor drives, Solar Inverters as well as PC Silverbox and Lighting applications.
Diodes and Rectifiers, Infineon
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 16,59
Each (In a Tube of 50) (be PVM)
€ 20,074
Each (In a Tube of 50) (su PVM)
50
€ 16,59
Each (In a Tube of 50) (be PVM)
€ 20,074
Each (In a Tube of 50) (su PVM)
50
Techniniai dokumentai
Specifikacijos
Markė
InfineonTvirtinimo tipas
Through Hole
Pakuotės tipas
TO-220
Maximum Continuous Forward Current
15A
Peak Reverse Repetitive Voltage
1200V
Diode Configuration
Single
Rectifier Type
High Voltage
Diode Type
SiC Schottky
Kaiščių skaičius
2
Maximum Forward Voltage Drop
2.55V
Number of Elements per Chip
1
Diode Technology
SiC Schottky
Peak Non-Repetitive Forward Surge Current
78A
Kilmės šalis
Singapore
Produkto aprašymas
thinQ! Silicon Carbide (SiC) Schottky Diode, Infineon
The Infineon thinQ!™ Generation 5 offers a new thin wafer technology for SiC Schottky Barrier diodes improving the thermal characteristics. The SiC Schottky Diode devices offer advantageous high voltage power semiconductor features such as higher breakdown field strength and improved thermal conductivity allowing greater efficiency levels. This latest generation is suitable for use in Telecom SMPS and high-end Servers, UPS systems, Motor drives, Solar Inverters as well as PC Silverbox and Lighting applications.