Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
€ 29.50
€ 29.50 Each (Exc. Vat)
€ 35.70
€ 35.70 Each (inc. VAT)
1

€ 29.50
€ 29.50 Each (Exc. Vat)
€ 35.70
€ 35.70 Each (inc. VAT)
Stock information temporarily unavailable.
1

| Quantity | Unit price |
|---|---|
| 1 - 4 | € 29.50 |
| 5 - 9 | € 28.30 |
| 10 - 39 | € 26.80 |
| 40+ | € 24.50 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
