Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 70.50
€ 70.50 Each (Exc. Vat)
€ 85.30
€ 85.30 Each (inc. VAT)
1

€ 70.50
€ 70.50 Each (Exc. Vat)
€ 85.30
€ 85.30 Each (inc. VAT)
Stock information temporarily unavailable.
1

Stock information temporarily unavailable.
| Quantity | Unit price | 
|---|---|
| 1 - 9 | € 70.50 | 
| 10 - 19 | € 68.00 | 
| 20 - 49 | € 66.00 | 
| 50+ | € 60.00 | 
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
