BI Technologies, HM76, 30 Wire-wound SMD Inductor 100 μH ±20% Wire-Wound 1.5A Idc
Technical Document
Specifications
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C
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Stock information temporarily unavailable.
Price on Asking
Each (In a Pack of 10) (Exc. Vat)
10
Price on Asking
Each (In a Pack of 10) (Exc. Vat)
Stock information temporarily unavailable.
10
Ideate. Create. Collaborate
JOIN FOR FREE
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Technical Document
Specifications
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products