Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
41.91 x 28.96mm
Thickness
0.015in
Ilgis
41.91mm
Plotis
28.96mm
Thermal Conductivity
3.5W/m·K
Medžiaga
Fibreglass
Minimali darbinė temperatūra
-60°C
Maksimali darbinė temperatūra
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Kilmės šalis
United States
Produkto aprašymas
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 75,05
€ 7,505 Each (In a Pack of 10) (be PVM)
€ 90,81
€ 9,081 Each (In a Pack of 10) (su PVM)
10

€ 75,05
€ 7,505 Each (In a Pack of 10) (be PVM)
€ 90,81
€ 9,081 Each (In a Pack of 10) (su PVM)
10

Pirkti dideliais kiekiais
kiekis | Vieneto kaina | Per Pakuotė |
---|---|---|
10 - 40 | € 7,505 | € 75,05 |
50 - 240 | € 7,22 | € 72,20 |
250+ | € 6,65 | € 66,50 |
Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
41.91 x 28.96mm
Thickness
0.015in
Ilgis
41.91mm
Plotis
28.96mm
Thermal Conductivity
3.5W/m·K
Medžiaga
Fibreglass
Minimali darbinė temperatūra
-60°C
Maksimali darbinė temperatūra
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Kilmės šalis
United States
Produkto aprašymas
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.