Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Techniniai dokumentai
Specifikacijos
Markė
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Medžiaga
Hi-Flow 650P
Self-Adhesive
Yes
Minimali darbinė temperatūra
-40°C
Maksimali darbinė temperatūra
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Kilmės šalis
United States
Produkto aprašymas
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 2,802
Each (In a Bag of 50) (be PVM)
€ 3,391
Each (In a Bag of 50) (su PVM)
50
€ 2,802
Each (In a Bag of 50) (be PVM)
€ 3,391
Each (In a Bag of 50) (su PVM)
50
Techniniai dokumentai
Specifikacijos
Markė
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Medžiaga
Hi-Flow 650P
Self-Adhesive
Yes
Minimali darbinė temperatūra
-40°C
Maksimali darbinė temperatūra
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Kilmės šalis
United States
Produkto aprašymas
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.