Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
11 x 12in
Thickness
0.102mm
Ilgis
11in
Plotis
12in
Thermal Conductivity
1W/m·K
Medžiaga
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maksimali darbinė temperatūra
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Kilmės šalis
United States
Produkto aprašymas
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
€ 62,70
€ 62,70 už 1 vnt. (be PVM)
€ 75,87
€ 75,87 už 1 vnt. (su PVM)
1
€ 62,70
€ 62,70 už 1 vnt. (be PVM)
€ 75,87
€ 75,87 už 1 vnt. (su PVM)
1
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
| kiekis | Vieneto kaina |
|---|---|
| 1 - 49 | € 62,70 |
| 50 - 99 | € 60,32 |
| 100 - 249 | € 56,05 |
| 250 - 499 | € 54,15 |
| 500+ | € 52,72 |
Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
11 x 12in
Thickness
0.102mm
Ilgis
11in
Plotis
12in
Thermal Conductivity
1W/m·K
Medžiaga
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maksimali darbinė temperatūra
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Kilmės šalis
United States
Produkto aprašymas
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules