Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

RS kodas: 903-3144Gamintojas: ABL ComponentsGamintojo kodas: 180AB1000B
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Techniniai dokumentai

Specifikacijos

For Use With

Universal Rectangular Alu

Ilgis

100mm

Plotis

215mm

Aukštis

77mm

Matmenys

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Serija

100

Medžiaga

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Kilmės šalis

United Kingdom

Produkto aprašymas

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Sandėlio informacija laikinai nepasiekiama.

€ 71,72

€ 71,72 už 1 vnt. (be PVM)

€ 86,78

€ 86,78 už 1 vnt. (su PVM)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
sticker-462

€ 71,72

€ 71,72 už 1 vnt. (be PVM)

€ 86,78

€ 86,78 už 1 vnt. (su PVM)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
Sandėlio informacija laikinai nepasiekiama.
sticker-462

Sandėlio informacija laikinai nepasiekiama.

Patikrinkite dar kartą.

kiekisVieneto kaina
1 - 4€ 71,72
5 - 9€ 67,92
10 - 24€ 63,18
25 - 99€ 60,80
100+€ 40,56

Techniniai dokumentai

Specifikacijos

For Use With

Universal Rectangular Alu

Ilgis

100mm

Plotis

215mm

Aukštis

77mm

Matmenys

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Serija

100

Medžiaga

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Kilmės šalis

United Kingdom

Produkto aprašymas

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.