Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

RS kodas: 674-4756Gamintojas: Fischer ElektronikGamintojo kodas: ICK BGA 14x14x10
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Techniniai dokumentai

Specifikacijos

For Use With

Universal Square Alu

Ilgis

14mm

Plotis

14mm

Aukštis

10mm

Matmenys

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Spalva

Black

Pakuotės tipas

BGA

Medžiaga

Aluminium

Kilmės šalis

Germany

Produkto aprašymas

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

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€ 2,18

už 1 vnt. (be PVM)

€ 2,64

už 1 vnt. (su PVM)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil
sticker-462

€ 2,18

už 1 vnt. (be PVM)

€ 2,64

už 1 vnt. (su PVM)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil
Sandėlio informacija laikinai nepasiekiama.
sticker-462

Pirkti dideliais kiekiais

kiekisVieneto kaina
1 - 9€ 2,18
10 - 24€ 2,00
25 - 49€ 1,85
50 - 99€ 1,80
100+€ 1,66

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Techniniai dokumentai

Specifikacijos

For Use With

Universal Square Alu

Ilgis

14mm

Plotis

14mm

Aukštis

10mm

Matmenys

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Spalva

Black

Pakuotės tipas

BGA

Medžiaga

Aluminium

Kilmės šalis

Germany

Produkto aprašymas

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more