STMicroelectronics Type N-Channel MOSFET, 64 A, 650 V, 3-Pin ACEPACK SMIT

The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.

• Half bridge power module
• 650 V blocking voltage
• Fast recovery body diode
• Very low switching energies
• Low package inductance