Techniniai Dokumentai
Specifikacijos
Markė
STMicroelectronicsUnbalance Impedance
50Ω
Product Type
Chip Balun
Balance Impedance
50Ω
Maximum Insertion Loss
1.85dB
Mount Type
Surface
Kaiščių skaičius
4
Maximum Frequency
2.5GHz
Minimum Frequency
2400MHz
Minimali darbinė temperatūra
-40°C
Pakuotės tipas
CSPG
Maksimali darbinė temperatūra
105°C
Ilgis
1.385mm
Standards/Approvals
No
Serija
BALF-NRG-02D3
Produkto Aprašymas
Baluns use STs process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
This device is an ultra-miniature balun which integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver. The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance
Sandėlio informacija laikinai nepasiekiama.
€ 11,95
€ 0,239 Each (In a Pack of 50) (be PVM)
€ 14,46
€ 0,289 Each (In a Pack of 50) (su PVM)
Standartas
50
€ 11,95
€ 0,239 Each (In a Pack of 50) (be PVM)
€ 14,46
€ 0,289 Each (In a Pack of 50) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
Standartas
50
| kiekis | Vieneto kaina | Per Pakuotė |
|---|---|---|
| 50 - 450 | € 0,239 | € 11,95 |
| 500 - 2450 | € 0,211 | € 10,55 |
| 2500 - 4950 | € 0,188 | € 9,40 |
| 5000+ | € 0,162 | € 8,10 |
Techniniai Dokumentai
Specifikacijos
Markė
STMicroelectronicsUnbalance Impedance
50Ω
Product Type
Chip Balun
Balance Impedance
50Ω
Maximum Insertion Loss
1.85dB
Mount Type
Surface
Kaiščių skaičius
4
Maximum Frequency
2.5GHz
Minimum Frequency
2400MHz
Minimali darbinė temperatūra
-40°C
Pakuotės tipas
CSPG
Maksimali darbinė temperatūra
105°C
Ilgis
1.385mm
Standards/Approvals
No
Serija
BALF-NRG-02D3
Produkto Aprašymas
Baluns use STs process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
This device is an ultra-miniature balun which integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver. The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance
