Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Serija
SEAF
Minimali darbinė temperatūra
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maksimali darbinė temperatūra
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Produkto Aprašymas
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Sandėlio informacija laikinai nepasiekiama.
€ 5 445,00
€ 24,20 Each (On a Reel of 225) (be PVM)
€ 6 588,45
€ 29,282 Each (On a Reel of 225) (su PVM)
225

€ 5 445,00
€ 24,20 Each (On a Reel of 225) (be PVM)
€ 6 588,45
€ 29,282 Each (On a Reel of 225) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
225

Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Serija
SEAF
Minimali darbinė temperatūra
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maksimali darbinė temperatūra
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Produkto Aprašymas
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.