Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
400
Product Type
PCB Socket
Number of Rows
10
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Serija
SEAF
Minimali darbinė temperatūra
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maksimali darbinė temperatūra
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Produkto Aprašymas
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Sandėlio informacija laikinai nepasiekiama.
€ 6 775,00
€ 27,10 Each (On a Reel of 250) (be PVM)
€ 8 197,75
€ 32,791 Each (On a Reel of 250) (su PVM)
250

€ 6 775,00
€ 27,10 Each (On a Reel of 250) (be PVM)
€ 8 197,75
€ 32,791 Each (On a Reel of 250) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
250

Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
400
Product Type
PCB Socket
Number of Rows
10
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Serija
SEAF
Minimali darbinė temperatūra
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maksimali darbinė temperatūra
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Produkto Aprašymas
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.