Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Serija
ASP
Row Pitch
6.18mm
Minimali darbinė temperatūra
-55°C
Maksimali darbinė temperatūra
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Kilmės šalis
Costa Rica
Produkto Aprašymas
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Sandėlio informacija laikinai nepasiekiama.
€ 571,20
€ 13,60 Each (In a Tray of 42) (be PVM)
€ 691,15
€ 16,456 Each (In a Tray of 42) (su PVM)
42

€ 571,20
€ 13,60 Each (In a Tray of 42) (be PVM)
€ 691,15
€ 16,456 Each (In a Tray of 42) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
42

Techniniai Dokumentai
Specifikacijos
Markė
SamtecKontaktų skaičius
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Serija
ASP
Row Pitch
6.18mm
Minimali darbinė temperatūra
-55°C
Maksimali darbinė temperatūra
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Kilmės šalis
Costa Rica
Produkto Aprašymas
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.