Techniniai Dokumentai
Specifikacijos
Markė
onsemiProduct Type
Optocoupler
Mount Type
Surface
Maximum Forward Voltage
1.3V
Number of Channels
1
Packaging
Tape & Reel
Number of Pins
8
Pakuotės tipas
SOIC
Input Current Type
DC
Typical Rise Time
8μs
Maximum Input Current
60mA
Logic Output
Yes
Minimali darbinė temperatūra
-40°C
Maximum Current Transfer Ratio
1000%
Maksimali darbinė temperatūra
100°C
Typical Fall Time
45μs
Minimum Current Transfer Ratio
500%
Standards/Approvals
DIN, UL, EN
Serija
MOCD
Automotive Standard
No
Kilmės šalis
Thailand
Produkto Aprašymas
The MOCD223M consists of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon photo darlington detector, in a surface mountable, small outline, plastic package. The MOCD223M is a dual-channel version of the MOC223M. They are ideally suited for high density applications, and eliminates the need for through the board mounting.
Sandėlio informacija laikinai nepasiekiama.
€ 1 275,00
€ 0,51 Each (On a Reel of 2500) (be PVM)
€ 1 542,75
€ 0,617 Each (On a Reel of 2500) (su PVM)
2500
€ 1 275,00
€ 0,51 Each (On a Reel of 2500) (be PVM)
€ 1 542,75
€ 0,617 Each (On a Reel of 2500) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
2500
Techniniai Dokumentai
Specifikacijos
Markė
onsemiProduct Type
Optocoupler
Mount Type
Surface
Maximum Forward Voltage
1.3V
Number of Channels
1
Packaging
Tape & Reel
Number of Pins
8
Pakuotės tipas
SOIC
Input Current Type
DC
Typical Rise Time
8μs
Maximum Input Current
60mA
Logic Output
Yes
Minimali darbinė temperatūra
-40°C
Maximum Current Transfer Ratio
1000%
Maksimali darbinė temperatūra
100°C
Typical Fall Time
45μs
Minimum Current Transfer Ratio
500%
Standards/Approvals
DIN, UL, EN
Serija
MOCD
Automotive Standard
No
Kilmės šalis
Thailand
Produkto Aprašymas
The MOCD223M consists of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon photo darlington detector, in a surface mountable, small outline, plastic package. The MOCD223M is a dual-channel version of the MOC223M. They are ideally suited for high density applications, and eliminates the need for through the board mounting.
