Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
Header
Serija
87759
Pitch
2mm
Current
2A
Kontaktų skaičius
4
Housing Material
Nylon
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Unshrouded
Mount Type
Surface Mount
Connector System
Board to Board Connectivity
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimali darbinė temperatūra
-55°C
Row Pitch
2mm
Termination Type
Surface Mount
Maksimali darbinė temperatūra
105°C
Standards/Approvals
UL E29179
Voltage
125V
Kilmės šalis
Indonesia
Produkto Aprašymas
The Molex Milli Grid Header is engineered to facilitate reliable board-to-board connections with its Compact vertical design and four-circuit capacity. Its surface mount configuration, coupled with selective gold plating, ensures superior conductivity and longevity while promoting a lead-free assembly process. Tailored for applications demanding precision and durability, this header meets industry compliance standards, making it an Ideal choice for reliable electronic integration in diverse PCB environments.
Sandėlio informacija laikinai nepasiekiama.
€ 405,00
€ 405,00 1 Tray of 250 (be PVM)
€ 490,05
€ 490,05 1 Tray of 250 (su PVM)
1
€ 405,00
€ 405,00 1 Tray of 250 (be PVM)
€ 490,05
€ 490,05 1 Tray of 250 (su PVM)
Sandėlio informacija laikinai nepasiekiama.
1
Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
Header
Serija
87759
Pitch
2mm
Current
2A
Kontaktų skaičius
4
Housing Material
Nylon
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Unshrouded
Mount Type
Surface Mount
Connector System
Board to Board Connectivity
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimali darbinė temperatūra
-55°C
Row Pitch
2mm
Termination Type
Surface Mount
Maksimali darbinė temperatūra
105°C
Standards/Approvals
UL E29179
Voltage
125V
Kilmės šalis
Indonesia
Produkto Aprašymas
The Molex Milli Grid Header is engineered to facilitate reliable board-to-board connections with its Compact vertical design and four-circuit capacity. Its surface mount configuration, coupled with selective gold plating, ensures superior conductivity and longevity while promoting a lead-free assembly process. Tailored for applications demanding precision and durability, this header meets industry compliance standards, making it an Ideal choice for reliable electronic integration in diverse PCB environments.