Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
43045
Pitch
3mm
Current
8.5A
Kontaktų skaičius
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimali darbinė temperatūra
-40°C
Termination Type
Through Hole
Maksimali darbinė temperatūra
105°C
Kilmės šalis
China
Produkto Aprašymas
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.
Sandėlio informacija laikinai nepasiekiama.
€ 10,70
€ 10,70 1 Pack of 2 (be PVM)
€ 12,95
€ 12,95 1 Pack of 2 (su PVM)
1
€ 10,70
€ 10,70 1 Pack of 2 (be PVM)
€ 12,95
€ 12,95 1 Pack of 2 (su PVM)
Sandėlio informacija laikinai nepasiekiama.
1
| kiekis | Vieneto kaina |
|---|---|
| 1 - 9 | € 10,70 |
| 10 - 24 | € 9,80 |
| 25+ | € 8,90 |
Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
43045
Pitch
3mm
Current
8.5A
Kontaktų skaičius
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimali darbinė temperatūra
-40°C
Termination Type
Through Hole
Maksimali darbinė temperatūra
105°C
Kilmės šalis
China
Produkto Aprašymas
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.