Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
43045
Pitch
3mm
Current
8.5A
Kontaktų skaičius
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Surface
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimali darbinė temperatūra
-40°C
Termination Type
Solder
Maksimali darbinė temperatūra
125°C
Standards/Approvals
IEC 60335-1
Kilmės šalis
China
Produkto Aprašymas
The Molex Micro-Fit 3.0 Vertical Header is engineered for efficient and reliable wire-to-board connections, featuring a robust dual-row design with 16 circuits. This product is perfect for applications requiring a Compact form factor and high-temperature resilience. It boasts a gold-plated Interface ensuring superior conductivity and durability, while its Glow-Wire capability aligns with stringent safety standards. With a recommended PCB thickness of 1.60mm and a vertical orientation, it facilitates easy integration into diverse electronic assemblies. The intelligent design of this header exemplifies precision engineering, accommodating various lead-free solder processes and maintaining performance in demanding environments, making it an Ideal choice for modern PCB design.
Sandėlio informacija laikinai nepasiekiama.
€ 1 105,00
€ 1 105,00 1 Reel of 200 (be PVM)
€ 1 337,05
€ 1 337,05 1 Reel of 200 (su PVM)
1
€ 1 105,00
€ 1 105,00 1 Reel of 200 (be PVM)
€ 1 337,05
€ 1 337,05 1 Reel of 200 (su PVM)
Sandėlio informacija laikinai nepasiekiama.
1
Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
43045
Pitch
3mm
Current
8.5A
Kontaktų skaičius
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Surface
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimali darbinė temperatūra
-40°C
Termination Type
Solder
Maksimali darbinė temperatūra
125°C
Standards/Approvals
IEC 60335-1
Kilmės šalis
China
Produkto Aprašymas
The Molex Micro-Fit 3.0 Vertical Header is engineered for efficient and reliable wire-to-board connections, featuring a robust dual-row design with 16 circuits. This product is perfect for applications requiring a Compact form factor and high-temperature resilience. It boasts a gold-plated Interface ensuring superior conductivity and durability, while its Glow-Wire capability aligns with stringent safety standards. With a recommended PCB thickness of 1.60mm and a vertical orientation, it facilitates easy integration into diverse electronic assemblies. The intelligent design of this header exemplifies precision engineering, accommodating various lead-free solder processes and maintaining performance in demanding environments, making it an Ideal choice for modern PCB design.