Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
iGrid 2.0
Pitch
2mm
Current
2A
Housing Material
Polyamide
Kontaktų skaičius
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Plating
Gold
Contact Material
Brass
Minimali darbinė temperatūra
-40°C
Row Pitch
2mm
Termination Type
Solder
Tail Pin Length
3.2mm
Maksimali darbinė temperatūra
105°C
Standards/Approvals
UL E29179
Voltage
250V
Kilmės šalis
Japan
Produkto Aprašymas
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
Sandėlio informacija laikinai nepasiekiama.
€ 180,00
€ 180,00 1 Tray of 100 (be PVM)
€ 217,80
€ 217,80 1 Tray of 100 (su PVM)
1

€ 180,00
€ 180,00 1 Tray of 100 (be PVM)
€ 217,80
€ 217,80 1 Tray of 100 (su PVM)
Sandėlio informacija laikinai nepasiekiama.
1

Techniniai Dokumentai
Specifikacijos
Markė
MolexProduct Type
PCB Header
Serija
iGrid 2.0
Pitch
2mm
Current
2A
Housing Material
Polyamide
Kontaktų skaičius
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Plating
Gold
Contact Material
Brass
Minimali darbinė temperatūra
-40°C
Row Pitch
2mm
Termination Type
Solder
Tail Pin Length
3.2mm
Maksimali darbinė temperatūra
105°C
Standards/Approvals
UL E29179
Voltage
250V
Kilmės šalis
Japan
Produkto Aprašymas
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.