Techniniai Dokumentai
Specifikacijos
Markė
IsocomProduct Type
Optocoupler
Mount Type
Through Hole
Maximum Forward Voltage
1.4V
Number of Channels
1
Number of Pins
4
Typical Rise Time
5μs
Maximum Input Current
50mA
Isolation Voltage
5.3kVrms
Minimali darbinė temperatūra
-55°C
Maximum Current Transfer Ratio
600%
Maksimali darbinė temperatūra
125°C
Typical Fall Time
6μs
Minimum Current Transfer Ratio
20%
Standards/Approvals
UL Approval E250824
Serija
TIL191
Automotive Standard
No
Kilmės šalis
Thailand
Produkto Aprašymas
These devices are single optocouplers. Each channel is composed of a Gallium Arsenide infra-red emitting diode and a silicon phototransistor. Package styles for these devices are4 pin with surface mount, butt cut and gull wing options available. The same electrical die, assembly processes and materials are used for each channel of each device shown below. Therefore absolute maximum ratings, recommended operating conditions, electrical specifications and performance characteristics are identical for all units. Any exceptions, due to packaging variations and limitations, are as noted.
Sandėlio informacija laikinai nepasiekiama.
€ 12,00
€ 0,12 Each (In a Tube of 100) (be PVM)
€ 14,52
€ 0,145 Each (In a Tube of 100) (su PVM)
100
€ 12,00
€ 0,12 Each (In a Tube of 100) (be PVM)
€ 14,52
€ 0,145 Each (In a Tube of 100) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
100
Techniniai Dokumentai
Specifikacijos
Markė
IsocomProduct Type
Optocoupler
Mount Type
Through Hole
Maximum Forward Voltage
1.4V
Number of Channels
1
Number of Pins
4
Typical Rise Time
5μs
Maximum Input Current
50mA
Isolation Voltage
5.3kVrms
Minimali darbinė temperatūra
-55°C
Maximum Current Transfer Ratio
600%
Maksimali darbinė temperatūra
125°C
Typical Fall Time
6μs
Minimum Current Transfer Ratio
20%
Standards/Approvals
UL Approval E250824
Serija
TIL191
Automotive Standard
No
Kilmės šalis
Thailand
Produkto Aprašymas
These devices are single optocouplers. Each channel is composed of a Gallium Arsenide infra-red emitting diode and a silicon phototransistor. Package styles for these devices are4 pin with surface mount, butt cut and gull wing options available. The same electrical die, assembly processes and materials are used for each channel of each device shown below. Therefore absolute maximum ratings, recommended operating conditions, electrical specifications and performance characteristics are identical for all units. Any exceptions, due to packaging variations and limitations, are as noted.
