Molex MicroClasp Series Right Angle Through Hole PCB Header, 18 Contact(s), 2.0mm Pitch, 2 Row(s), Shrouded
Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Srovės įvertinimas
3.0A
Series Number
55959
Įtampos reitingas
250.0 V
Kilmės šalis
Japan
Produkto aprašymas
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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€ 7,75
€ 0,775 Each (In a Pack of 10) (be PVM)
€ 9,38
€ 0,938 Each (In a Pack of 10) (su PVM)
Standartas
10
€ 7,75
€ 0,775 Each (In a Pack of 10) (be PVM)
€ 9,38
€ 0,938 Each (In a Pack of 10) (su PVM)
Sandėlio informacija laikinai nepasiekiama.
Standartas
10
Sandėlio informacija laikinai nepasiekiama.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Srovės įvertinimas
3.0A
Series Number
55959
Įtampos reitingas
250.0 V
Kilmės šalis
Japan
Produkto aprašymas
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products