Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 46.84
€ 46.84 Each (Exc. Vat)
€ 56.68
€ 56.68 Each (inc. VAT)
1

€ 46.84
€ 46.84 Each (Exc. Vat)
€ 56.68
€ 56.68 Each (inc. VAT)
1

Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price |
---|---|
1 - 9 | € 46.84 |
10 - 19 | € 44.94 |
20 - 49 | € 43.51 |
50+ | € 39.80 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips