Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
28.96 x 20.57mm
Thickness
0.015in
Ilgis
28.96mm
Plotis
20.57mm
Thermal Conductivity
3.5W/m·K
Medžiaga
Fibreglass
Minimali darbinė temperatūra
-60°C
Maksimali darbinė temperatūra
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Kilmės šalis
United States
Produkto aprašymas
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 29,45
€ 2,945 Each (In a Pack of 10) (be PVM)
€ 35,63
€ 3,563 Each (In a Pack of 10) (su PVM)
10
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€ 29,45
€ 2,945 Each (In a Pack of 10) (be PVM)
€ 35,63
€ 3,563 Each (In a Pack of 10) (su PVM)
10

Pirkti dideliais kiekiais
kiekis | Vieneto kaina | Per Pakuotė |
---|---|---|
10 - 40 | € 2,945 | € 29,45 |
50 - 190 | € 2,85 | € 28,50 |
200 - 490 | € 2,612 | € 26,12 |
500 - 990 | € 2,565 | € 25,65 |
1000+ | € 2,47 | € 24,70 |
Techniniai dokumentai
Specifikacijos
Markė
BergquistMatmenys
28.96 x 20.57mm
Thickness
0.015in
Ilgis
28.96mm
Plotis
20.57mm
Thermal Conductivity
3.5W/m·K
Medžiaga
Fibreglass
Minimali darbinė temperatūra
-60°C
Maksimali darbinė temperatūra
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Kilmės šalis
United States
Produkto aprašymas
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.