Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Solder
Contact Plating
Tin
Srovės įvertinimas
3.0A
Series Number
55932
Įtampos reitingas
250.0 V
Kilmės šalis
Japan
Produkto aprašymas
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
€ 3,42
€ 0,342 Each (In a Pack of 10) (be PVM)
€ 4,14
€ 0,414 Each (In a Pack of 10) (su PVM)
Standartas
10

€ 3,42
€ 0,342 Each (In a Pack of 10) (be PVM)
€ 4,14
€ 0,414 Each (In a Pack of 10) (su PVM)
Standartas
10

Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
kiekis | Vieneto kaina | Per Pakuotė |
---|---|---|
10 - 240 | € 0,342 | € 3,42 |
250 - 990 | € 0,252 | € 2,52 |
1000 - 4990 | € 0,196 | € 1,96 |
5000 - 9990 | € 0,181 | € 1,81 |
10000+ | € 0,171 | € 1,71 |
Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Through Hole
Užbaigimo būdas
Solder
Contact Plating
Tin
Srovės įvertinimas
3.0A
Series Number
55932
Įtampos reitingas
250.0 V
Kilmės šalis
Japan
Produkto aprašymas
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.