Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Surface Mount
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Srovės įvertinimas
3.0A
Series Number
55917
Įtampos reitingas
250.0 V
Produkto aprašymas
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Sandėlio informacija laikinai nepasiekiama.
Patikrinkite dar kartą.
€ 1 826,66
€ 0,415 Each (In a Tray of 4400) (be PVM)
€ 2 210,26
€ 0,502 Each (In a Tray of 4400) (su PVM)
4400

€ 1 826,66
€ 0,415 Each (In a Tray of 4400) (be PVM)
€ 2 210,26
€ 0,502 Each (In a Tray of 4400) (su PVM)
4400

Techniniai dokumentai
Specifikacijos
Markė
MolexSerija
MICROCLASP
Pitch
2.0mm
Kontaktų skaičius
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Tvirtinimo tipas
Surface Mount
Užbaigimo būdas
Solder
Contact Plating
Tin
Contact Material
Brass
Srovės įvertinimas
3.0A
Series Number
55917
Įtampos reitingas
250.0 V
Produkto aprašymas
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.