Techniniai dokumentai
Specifikacijos
Markė
Amphenol ICCKontaktų skaičius
15
Gender
Male
Body Orientation
Straight
Tvirtinimo tipas
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Užbaigimo būdas
Solder
D-Sub Shell Size
E
Srovės įvertinimas
2.5A
Housing Material
Steel
Įtampos reitingas
250.0 V
Ilgis
30.81mm
Plotis
4.8mm
Gylis
12.55mm
Matmenys
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimali darbinė temperatūra
-55.0°C
Maksimali darbinė temperatūra
+105°C
Kilmės šalis
China
Produkto aprašymas
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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Patikrinkite dar kartą.
€ 0,95
Each (In a Tray of 90) (be PVM)
€ 1,15
Each (In a Tray of 90) (su PVM)
90
€ 0,95
Each (In a Tray of 90) (be PVM)
€ 1,15
Each (In a Tray of 90) (su PVM)
90
Techniniai dokumentai
Specifikacijos
Markė
Amphenol ICCKontaktų skaičius
15
Gender
Male
Body Orientation
Straight
Tvirtinimo tipas
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Užbaigimo būdas
Solder
D-Sub Shell Size
E
Srovės įvertinimas
2.5A
Housing Material
Steel
Įtampos reitingas
250.0 V
Ilgis
30.81mm
Plotis
4.8mm
Gylis
12.55mm
Matmenys
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimali darbinė temperatūra
-55.0°C
Maksimali darbinė temperatūra
+105°C
Kilmės šalis
China
Produkto aprašymas
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.